The water-cooled plate radiator has a very good effect on the heat dissipation of high-power devices, so many users will choose the cooling solution of the water-cooled plate radiator. The production process of water-cooled plates is more complicated than that of general air-cooled radiators. Liquid-cooled heat dissipation requires higher process reliability. Therefore, only manufacturers with strong technical precipitation can provide reliable technical support.

Copper and aluminum composite water cooling plate radiator

The buried pipe process is the most commonly used liquid-cooled radiator manufacturing custom process. Generally speaking, the aluminum substrate is buried in the copper pipe, that is, the aluminum substrate is machined and milled with CNC, and then the bent shape of the copper pipe is pressed to the aluminum by a punching machine. On the substrate, brazing is performed, and then processed into a water-cooled plate. There are generally three types of buried liquid cooling plates: one is shallow buried liquid cooling plate; the other is deep buried liquid cooling plate; the third is welded pipe technology; the fourth is double-sided clamping pipe liquid cooling plate. The three types of processes are not much different, and the difficulty of processing is also the same. Some liquid cooling principles originally designed for high-power switching devices can also be used for reference in power battery cooling systems.